Tecoi USA introduced its modular LS COV laser cutting machine, which incorporates a gantry that can move the closure independently without having to shift the enclosure. Users can process small to extralarge parts with high production agility on the same machine having a small footprint. With Dual Fiber Process (DFP) and Twin Disk beam split, productivity is doubled. The machine handles material lengths up to 210 ft. It features IMZ, an intelligent movement Z-axis system that reduces cutting time by up to 30 percent, while allowing faster and more accurate positioning of the head in the Z-axis.